Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Date of Patent
May 31, 2016
Patent Application Number
14723721
Date Filed
May 28, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes a package substrate including a ground pad; a a conductive spacer and a first semiconductor chip disposed on the package substrate; a second semiconductor chip on the conductive spacer and the first semiconductor chip; a molding unit that covers the package substrate, the first semiconductor chip, the second semiconductor chip, and a first portion of the conductive spacer, and exposes a second portion of the conductive spacer; and an electromagnetic interference (EMI) shield that covers the molding unit.
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