Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 13, 2015
Patent Application Number
13645397
Date Filed
October 4, 2012
Patent Citations Received
Patent Primary Examiner
Patent abstract
A flip chip interconnect of a die on a substrate is made by mating the interconnect bump onto a narrow interconnect pad on a lead or trace, rather than onto a capture pad. The width of the narrow interconnect pad is less than a base diameter of bumps on the die to be attached. Also, a flip chip package includes a die having solder bumps attached to interconnect pads in an active surface, and a substrate having narrow interconnect pads on electrically conductive traces in a die attach surface, in which the bumps are mated onto the narrow pads on the traces.
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