Is a
Patent attributes
Patent Applicant
0
Current Assignee
0
Patent Jurisdiction
Patent Number
Patent Inventor Names
Daniel Marvin Kinzer0
Date of Patent
April 23, 2019
0Patent Application Number
154349560
Date Filed
February 16, 2017
0Patent Citations Received
...
Patent Primary Examiner
Patent abstract
Electronic packages are formed from a generally planar leadframe having a plurality of leads coupled to a GaN-based semiconductor device, and are encased in an encapsulant. The plurality of leads are interdigitated and are at different voltage potentials.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
