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US Patent 10269688 Power overlay structure and method of making same
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Patent
Date Filed
May 20, 2013
Date of Patent
April 23, 2019
Patent Application Number
13897685
Patent Citations Received
US Patent 12007170 Thermal management in integrated circuit packages
0
US Patent 10607857 Semiconductor device assembly including a thermal interface bond between a semiconductor die and a passive heat exchanger
US Patent 11551993 Power overlay module and method of assembling
US Patent 11784108 Thermal management in integrated circuit packages
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
10269688
Patent Primary Examiner
Ismail A Muse
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