US Patent 12007170 Thermal management in integrated circuit packages

Is a

Patent

Patent attributes

Patent Applicant

Intel

Current Assignee

Intel

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

120071700

Patent Inventor Names

Telesphor Kamgaing0

Aleksandar Aleksov0

Georgios Dogiamis0

Feras Eid0

Johanna M. Swan0

Date of Patent

June 11, 2024

Patent Application Number

165332350

Date Filed

August 6, 2019

Patent Citations

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US Patent 9746889 Package-on-package (PoP) device comprising bi-directional thermal electric cooler

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US Patent 9837595 Semiconductor package assembly with thermal recycling function

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US Patent 9978732 Network with integrated passive device and conductive trace in packaging substrate and related modules and devices

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US Patent 10269688 Power overlay structure and method of making same

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US Patent 10504816 Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages

...

Patent Primary Examiner

‌

Nilufa Rahim

Patent abstract

Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

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US Patent 12007170 Thermal management in integrated circuit packages

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