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US Patent 12007170 Thermal management in integrated circuit packages

Patent 12007170 was granted and assigned to Intel on June, 2024 by the United States Patent and Trademark Office.

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 US Patent 12007170 Thermal management in integrated circuit packages

Article

Patent abstract

Disclosed herein are structures and assemblies that may be used for thermal management in integrated circuit (IC) packages.

Infobox
Is a
Patent
Patent
0
Patent Applicant
Intel
Intel
0
Current Assignee
Intel
Intel
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
120071700
Patent Inventor Names
Aleksandar Aleksov0
Feras Eid0
Georgios Dogiamis0
Johanna M. Swan0
Telesphor Kamgaing0
Date of Patent
June 11, 2024
0
Patent Application Number
165332350
Date Filed
August 6, 2019
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Patent Citations
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US Patent 7439617 Capillary underflow integral heat spreader
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US Patent 8564957 Cooling structure for electronic equipment
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US Patent 8780561 Conduction cooling of multi-channel flip chip based panel array circuits
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US Patent 9076754 3DIC packages with heat sinks attached to heat dissipating rings
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US Patent 9646910 Integrated heat spreader that maximizes heat transfer from a multi-chip package
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US Patent 9667210 Apparatus and methods for generating a variable regulated voltage
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US Patent 9671141 Thermoelectric cooling packages and thermal management methods thereof
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US Patent 9704788 Power overlay structure and method of making same
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US Patent 11221184 Carbon nanotube heat pipe or thermosiphon
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US Patent 9746889 Package-on-package (PoP) device comprising bi-directional thermal electric cooler
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US Patent 9837595 Semiconductor package assembly with thermal recycling function
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US Patent 9978732 Network with integrated passive device and conductive trace in packaging substrate and related modules and devices
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US Patent 11227859 Stacked package with electrical connections created using high throughput additive manufacturing
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US Patent 10269688 Power overlay structure and method of making same
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US Patent 10504816 Thermoelectric cooler (TEC) for spot cooling of 2.5D/3D IC packages
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US Patent 10510687 Packaging devices and methods for semiconductor devices
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US Patent 11011448 IC package including multi-chip unit with bonded integrated heat spreader
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US Patent 11480394 Heat pipes having wick structures with variable permeability
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US Patent 11535360 Hypersonic leading-edge heat pipe with porous wick, and methods of making and using the same
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Patent Primary Examiner
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Nilufa Rahim
0

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