Patent attributes
A heat sink for cooling an integrated circuit device includes a body having a first side and a second side. A fluid inlet opening is formed in the second side of the body for receiving pressurized fluid from a fluid source. A plurality of impingement openings are formed in the first side of the body. At least one fluid delivery channel is provided and configured to deliver pressurized fluid from the fluid inlet opening to the plurality of impingement openings for generating a plurality of fluid streams expelled from the plurality of impingement openings. A plurality of fluid diverters are formed on the first side of the body and arranged generally between each of the plurality of impingement openings for diverting a flow of fluid around each of the plurality of impingement openings.
