Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
June 11, 2019
Patent Application Number
15973630
Date Filed
May 8, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
Semiconductor devices including skip via structures and methods of forming the skip via structure include interconnection between two interconnect levels that are separated by at least one other interconnect level, i.e., skip via to connect Mx and Mx+2 interconnect levels, wherein a portion of the intervening metallization level (MX+1) is in a pathway of the skip via.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.