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US Patent 10319629 Skip via for metal interconnects

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
May 8, 2018
Date of Patent
June 11, 2019
Patent Application Number
15973630
Patent Citations Received
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US Patent 11876047 Decoupled interconnect structures
0
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US Patent 11600519 Skip-via proximity interconnect
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US Patent 11646264 Semiconductor structure with super via and manufacturing method thereof
0
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US Patent 11749561 Self-alignment etching of interconnect layers
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US Patent 10586012 Semiconductor process modeling to enable skip via in place and route flow
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US Patent 10831973 Semiconductor process modeling to enable skip via in place and route flow
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US Patent 10936782 Semiconductor process modeling to enable skip via in place and route flow
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10319629
Patent Primary Examiner
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Ratisha Mehta

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