US Patent 10319683 Multi-stacked package-on-package structures
Patent 10319683 was granted and assigned to Taiwan Semiconductor Manufacturing Company on June, 2019 by the United States Patent and Trademark Office.
Is a
Current Assignee
Date Filed
July 3, 2017
Date of Patent
June 11, 2019
Patent Applicant
Patent Application Number
15640882
Patent Citations Received
Patent Jurisdiction
Patent Number
Patent Primary Examiner
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