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US Patent 10321609 Cooling system and method of cooling electronic device

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
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Date Filed
October 19, 2017
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Date of Patent
June 11, 2019
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Patent Application Number
15787757
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Patent Citations Received
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US Patent 12137536 Systems and methods for autonomously activable redundant cooling of a heat generating component
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US Patent 10930579 Self-contained liquid cooled semiconductor packaging
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US Patent 11647607 Localized immersion cooling enclosure with thermal efficiency features
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US Patent 11649995 Devices, systems, and methods for the rapid transient cooling of pulsed heat sources
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US Patent 11924998 Hybrid immersion cooling system for rack-mounted electronic assemblies
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US Patent 12120847 Container for one or more electronic devices and methods of use thereof
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US Patent 12120846 Immersion cooling systems for electronic components
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US Patent 11571978 Passively cooled high power electric cable, system and method
Patent Inventor Names
Keita Hirai
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Naofumi Kosugi
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Tsuyoshi So
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10321609
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Patent Primary Examiner
James Wu
James Wu
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