Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 23, 2021
Patent Application Number
16796331
Date Filed
February 20, 2020
Patent Citations
Patent Primary Examiner
Patent abstract
A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.
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