US Patent 10930579 Self-contained liquid cooled semiconductor packaging
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Patent abstract
A liquid cooled semiconductor package and method for forming a liquid cooled semiconductor package is described. The device includes at least one semiconductor device mounted on a substrate. An impermeable housing is disposed on the substrate with an internal cavity. A liquid coolant is within the internal cavity such that the coolant immerses at least one semiconductor device.
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Patent Jurisdiction
Patent Number
109305790
Date of Patent
February 23, 2021
0Patent Application Number
167963310
Date Filed
February 20, 2020
0Official Website
Patent Citations
Patent Primary Examiner
Edits on 25 Sep, 2022
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Infobox
Is a
Patent Jurisdiction
Patent Number
109305790
Date of Patent
February 23, 2021
0Patent Application Number
167963310
Date Filed
February 20, 2020
0Official Website
Patent Citations
Patent Primary Examiner
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US Patent 10930579 Self-contained liquid cooled semiconductor packaging
Infobox
Is a
Patent jurisdiction
Patent number
10930579
Date of patent
February 23, 2021
Patent application number
16796331
Date Filed
February 20, 2020
Patent citations
Patent primary examiner
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