US Patent 10330874 Mixed-signal substrate with integrated through-substrate vias

Disclosed are a variety of mixed-signal substrates comprising a plurality of photo-defined through substrate vias and methods of making the same. In an embodiment, a mixed-signal substrate can comprise a plurality of trenches embedded in a substrate, a photodefineable polymer within at least a portion of each trench, the photodefineable polymer defining one or more channels within each of the plurality of trenches, and a conductive material filling at least a portion of the one or more channels within the photodefineable polymer to form one or more through substrate vias. The photo-defined through substrate vias can comprise a variety of arrangements, numbers of vias, shapes, and dimensions across a single substrate.