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US Patent 12068266 Hybrid coating for integrated circuit device

Patent 12068266 was granted and assigned to Raytheon Technologies on August, 2024 by the United States Patent and Trademark Office.

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Patent attributes

Current Assignee

Raytheon Technologies

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Patent Jurisdiction

United States Patent and Trademark Office

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Patent Number

Patent Inventor Names

Jarrod N. Vaillancourt0

William J. Davis0

Date of Patent

August 20, 2024

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Patent Application Number

175611130

Date Filed

December 23, 2021

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Patent Citations

US Patent 10330874 Mixed-signal substrate with integrated through-substrate vias

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US Patent 8969176 Laminated transferable interconnect for microelectronic package

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US Patent 10002836 Method of fabricating a semiconductor device and semiconductor product

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US Patent 7602599 Metal-metal capacitor and method of making the same

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US Patent 7902674 Three-dimensional die-stacking package structure

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Patent Primary Examiner

Walter H Swanson

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CPC Code

0

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Patent abstract

An interconnect layer for an integrated circuit device includes a low radio frequency (RF) loss primary coating that forms a main portion of the interconnect layer, an opening formed in the primary coating, a high aspect ratio patternable secondary coating within the opening, and a via formed in the secondary coating. An aspect ratio of the via is greater than an aspect ratio of the opening.

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