US Patent 12068266 Hybrid coating for integrated circuit device
Patent 12068266 was granted and assigned to Raytheon Technologies on August, 2024 by the United States Patent and Trademark Office.
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US Patent 12068266 Hybrid coating for integrated circuit device
Article
Patent abstract
An interconnect layer for an integrated circuit device includes a low radio frequency (RF) loss primary coating that forms a main portion of the interconnect layer, an opening formed in the primary coating, a high aspect ratio patternable secondary coating within the opening, and a via formed in the secondary coating. An aspect ratio of the via is greater than an aspect ratio of the opening.
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Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Jarrod N. Vaillancourt0
William J. Davis0
Date of Patent
August 20, 2024
0Patent Application Number
175611130
Date Filed
December 23, 2021
0Patent Citations
Patent Primary Examiner
CPC Code
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