Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Shih-Ting Hung0
Shin-Puu Jeng0
Chih-Hsien Lin0
Dai-Jang Chen0
Hsiang-Tai Lu0
Hsien-Wen Liu0
Po-Yao Chuang0
Date of Patent
July 9, 2019
0Patent Application Number
158762270
Date Filed
January 22, 2018
0Patent Citations
Patent Citations Received
Patent Primary Examiner
Patent abstract
Integrated fan-out packages and methods of forming the same are disclosed. An integrated fan-out package includes a first semiconductor chip, a plurality of through integrated fan-out vias, an encapsulation layer and a redistribution layer structure. The first semiconductor chip includes a heat dissipation layer, and the heat dissipation layer covers at least 30 percent of a first surface of the first semiconductor chip. The through integrated fan-out vias are aside the first semiconductor chip. The encapsulation layer encapsulates the through integrated fan-out vias. The redistribution layer structure is at a first side of the first semiconductor chip and thermally connected to the heat dissipation layer of the first semiconductor chip.
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