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US Patent 10347574 Integrated fan-out packages
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Patent
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Date Filed
January 22, 2018
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Date of Patent
July 9, 2019
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Patent Application Number
15876227
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Patent Citations
US Patent 10211136 Fan-out semiconductor package
Patent Citations Received
US Patent 11380616 Fan out package-on-package with adhesive die attach
US Patent 10930525 Carrier substrate and method of manufacturing semiconductor package using the carrier substrate
US Patent 11476200 Semiconductor package structure having stacked die structure
Patent Inventor Names
Shih-Ting Hung
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Shin-Puu Jeng
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Chih-Hsien Lin
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Dai-Jang Chen
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Hsiang-Tai Lu
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Hsien-Wen Liu
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Po-Yao Chuang
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Patent Jurisdiction
United States Patent and Trademark Office
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Patent Number
10347574
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Patent Primary Examiner
Ida M. Soward
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