Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Min Jung Kim0
Chang Hoon Kwak0
Hak Hwan Kim0
Jin Hwan Kim0
Jin Kweon Chung0
Sung Jin Ahn0
Date of Patent
July 23, 2019
0Patent Application Number
159225780
Date Filed
March 15, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.
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