US Patent 10361351 Semiconductor light emitting element package including solder bump
Patent 10361351 was granted and assigned to Samsung on July, 2019 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor light-emitting diode (LED) package is provided and includes a semiconductor LED chip having a surface on which a first electrode and a second electrode are formed; a first solder bump formed on the first electrode and a second solder bump formed on the second electrode, the first solder bump and the second solder bump protruding from the surface of the semiconductor LED chip; and a resin layer having a bottom portion that surrounds a first side surface of the first solder bump and a second side surface of the second solder bump and covers the surface of the semiconductor LED chip.
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Patent Inventor Names
Chang Hoon Kwak0
Hak Hwan Kim0
Jin Hwan Kim0
Jin Kweon Chung0
Min Jung Kim0
Sung Jin Ahn0
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Patent Number
103613510
Date of Patent
July 23, 2019
0Patent Application Number
159225780
Date Filed
March 15, 2018
0Official Website
Patent Citations Received
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US Patent 10361351 Semiconductor light emitting element package including solder bump
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10361351
Date of patent
July 23, 2019
Patent application number
15922578
Date Filed
March 15, 2018
Patent primary examiner
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