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US Patent 10368427 Plasmas and methods of using them

Patent 10368427 was granted and assigned to PerkinElmer on July, 2019 by the United States Patent and Trademark Office.

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Patent
Patent
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Patent attributes

Current Assignee
PerkinElmer
PerkinElmer
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
103684270
Patent Inventor Names
Peter J Morrisroe0
Date of Patent
July 30, 2019
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Patent Application Number
141588360
Date Filed
January 19, 2014
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Patent Citations Received
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US Patent 11942306 Atomic layer etching by electron wavefront
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US Patent 11715623 DC plasma control for electron enhanced material processing
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US Patent 11412606 Plasma generator and information processing method
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US Patent 11869747 Atomic layer etching by electron wavefront
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US Patent 11887823 Electron bias control signals for electron enhanced material processing
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US Patent 11664195 DC plasma control for electron enhanced material processing
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US Patent 11676797 DC plasma control for electron enhanced material processing
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US Patent 11688588 Electron bias control signals for electron enhanced material processing
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Patent Primary Examiner
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Dana Ross
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Patent abstract

Plasma devices and methods for using such plasma devices in analytical measurements are disclosed. In certain examples, a low flow plasma may be operative using a total argon gas flow of less than about five liters per minute, and in some embodiments, a plasma argon gas flow of less than about four liter per minute. In other examples, a plasma produced using inductive and capacitive coupling is disclosed.

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