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US Patent 10368427 Plasmas and methods of using them

Patent 10368427 was granted and assigned to PerkinElmer on July, 2019 by the United States Patent and Trademark Office.

OverviewStructured DataIssuesContributors
Is a
Patent
Patent
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Current Assignee
PerkinElmer
PerkinElmer
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Date Filed
January 19, 2014
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Date of Patent
July 30, 2019
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Patent Application Number
14158836
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Patent Citations Received
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US Patent 11942306 Atomic layer etching by electron wavefront
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US Patent 11715623 DC plasma control for electron enhanced material processing
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US Patent 11412606 Plasma generator and information processing method
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US Patent 11869747 Atomic layer etching by electron wavefront
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US Patent 11887823 Electron bias control signals for electron enhanced material processing
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US Patent 11664195 DC plasma control for electron enhanced material processing
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US Patent 11676797 DC plasma control for electron enhanced material processing
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US Patent 11688588 Electron bias control signals for electron enhanced material processing
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Patent Inventor Names
Peter J Morrisroe
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Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
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Patent Number
10368427
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Patent Primary Examiner
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Dana Ross
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