Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kun-Chi Hsu0
Chin-Ta Wu0
Chui-Liang Chiu0
Jen-Tung Tseng0
Date of Patent
August 20, 2019
Patent Application Number
15989203
Date Filed
May 25, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A wafer processing method uses a chuck table with smaller diameter than a semiconductor wafer to be processed. A cut through edge trimming is therefore implemented on the periphery of the semiconductor wafer to form a cut through straight side at the periphery and also form a flat portion at the periphery as a positioning means for taping and backside grind processes.
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