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US Patent 10395986 Fully aligned via employing selective metal deposition

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
May 30, 2018
Date of Patent
August 27, 2019
Patent Application Number
15992685
Patent Citations Received
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US Patent 11495538 Fully aligned via for interconnect
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US Patent 11515203 Selective deposition of conductive cap for fully-aligned-via (FAV)
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US Patent 11935786 Contact features of semiconductor devices
0
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US Patent 11942426 Semiconductor structure having alternating selective metal and dielectric layers
0
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US Patent 12112984 Contact features of semiconductor devices
0
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US Patent 10879107 Method of forming barrier free contact for metal interconnects
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US Patent 11270912 Method for forming a via hole self-aligned with a metal block on a substrate
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US Patent 11664333 Method of manufacturing die seal ring
0
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US Patent 11764146 Microelectronic devices with self-aligned interconnects, and related methods
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10395986
Patent Primary Examiner
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Luan C Thai

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