Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yeong Kwon Ko0
Seung Won Park0
Date of Patent
September 3, 2019
0Patent Application Number
156577590
Date Filed
July 24, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor package includes a semiconductor chip in which a side step or a side slope formed toward an inactive surface from an active surface is included and a width of the active surface is smaller than a width of the inactive surface, and an underfill which is disposed on the active surface and positioned at an inner side of the edge of the semiconductor chip.
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