Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
February 14, 2023
Patent Application Number
17338815
Date Filed
June 4, 2021
Patent Citations
Patent Primary Examiner
A semiconductor package is provided. The semiconductor package includes a lower structure including an upper insulating layer and an upper pad; and a semiconductor chip provided on the lower structure and comprising a lower insulating layer and a lower pad. The lower insulating layer is in contact with and coupled to the upper insulating layer and the lower pad is in contact with and coupled to the upper pad, and a lateral side of the semiconductor chip extends between an upper side and a lower side of the semiconductor chip and comprises a recessed portion.
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