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US Patent 11581257 Semiconductor package

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
June 4, 2021
Date of Patent
February 14, 2023
Patent Application Number
17338815
Patent Citations
‌
US Patent 10872836 Package structure for heat dissipation
‌
US Patent 11031285 Diffusion barrier collar for interconnects
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US Patent 11164900 Image sensor chip-scale-package
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US Patent 11056432 Semiconductor package
‌
US Patent 11244936 Semiconductor device package and apparatus comprising the same
‌
US Patent 10403603 Semiconductor package and fabrication method thereof
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US Patent 10748875 Apparatus of semiconductor memory and method of manufacturing the same
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
11581257
Patent Primary Examiner
‌
Victoria K. Hall
CPC Code
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H01L 2924/10156
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H01L 21/78
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H01L 2224/94
‌
H01L 2224/95001
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H01L 2224/95091
‌
H01L 2224/97
‌
H01L 2924/10157
‌
H01L 2924/10158
‌
H01L 2924/10155

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