Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
September 17, 2019
Patent Application Number
16166767
Date Filed
October 22, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.
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