US Patent 10414013 Polishing method and polishing apparatus
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Patent abstract
The present invention relates to a polishing apparatus and a polishing method for polishing a substrate, such as a wafer, and more particularly to a polishing apparatus and a polishing method for polishing an edge portion of a wafer with use of a polishing tape.
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Patent Jurisdiction
Patent Number
104140130
Date of Patent
September 17, 2019
0Patent Application Number
161667670
Date Filed
October 22, 2018
0Official Website
Patent Citations Received
Patent Primary Examiner
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Patent Jurisdiction
Patent Number
104140130
Date of Patent
September 17, 2019
0Patent Application Number
161667670
Date Filed
October 22, 2018
0Official Website
Patent Citations Received
Patent Primary Examiner
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US Patent 10414013 Polishing method and polishing apparatus
Infobox
Is a
Patent jurisdiction
Patent number
10414013
Date of patent
September 17, 2019
Patent application number
16166767
Date Filed
October 22, 2018
Patent primary examiner
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