Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Taku Yanagihashi0
Shingo Izuchi0
Takeshi Tsukahara0
Date of Patent
September 17, 2019
0Patent Application Number
156758540
Date Filed
August 14, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
The present disclosure provides a conductor connecting structure that connects a cable to a substrate, where the substrate includes at least one connection pad, the cable includes at least one core wire, the core wire is connected to an upper surface of the connection pad through soldering, and the connection pad includes a solder storing part that is present further frontward than a front end of the core wire.
Timeline
No Timeline data yet.
Further Resources
No Further Resources data yet.
