Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Kishore N. Renjan
Manoj Vadeentavida
David M. Kindlon
Ali N. Ergun
Benjamin J. Grena
Kyusang Kim
Bilal Mohamed Ibrahim Kani
Lan H. Hoang
Date of Patent
September 19, 2023
Patent Application Number
17407670
Date Filed
August 20, 2021
Patent Citations
Patent Primary Examiner
Patent abstract
Electronic modules and methods of fabrication are described. In an embodiment, an electronic module includes a molded system-in-package, and a flexible circuit mounted on a side surface of a molding compound layer such that the flexible circuit is in electrical contact with a lateral interconnect exposed along the side surface of the molding compound layer.
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