Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Zhiguo Qian0
Kevin J Doran0
Md Altai Hossain0
Yu Amos Zhang0
Date of Patent
June 8, 2021
0Patent Application Number
164740050
Date Filed
March 29, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
A device and method of utilizing an interconnect bridge to electrically couple two semiconductor dies located on different surfaces. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a substrate to a semiconductor die on a motherboard are shown. Integrated circuit packages using an interconnect bridge to electrically couple a semiconductor die on a top surface of a substrate to a semiconductor die on a bottom surface of a substrate are shown. Methods of electrically coupling semiconductor dies on different surfaces using interconnect bridges are shown.
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