Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Christopher James Kapusta0
Marco Francesco Aimi0
Date of Patent
October 1, 2019
Patent Application Number
14841314
Date Filed
August 31, 2015
Patent Citations Received
Patent Primary Examiner
Patent abstract
In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (LCP) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.
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