US Patent 10432168 Systems and methods for quartz wafer bonding
All edits
Edits on 15 May, 2024
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 9 Dec, 2023
Golden AI
Edits made to:
Article (+358 characters)
Article
Patent abstract
In one embodiment, a bonded quartz wafer package includes a first quartz wafer including at least one quartz-based device, a second quartz wafer disposed above the first quartz wafer, and a liquid crystal polymer (LCP) bonding layer disposed in between the first and second quartz wafers that bonds the first and second quartz wafers together.
Edits on 2 Oct, 2023
Golden AI
Edits made to:
Infobox (+2 properties)
Infobox
Patent Inventor Names
Christopher James Kapusta0
Marco Francesco Aimi0
Edits on 19 Apr, 2023
Golden AI
Edits made to:
Infobox (+1 properties)
Infobox
Patent Citations Received
Edits on 29 Jan, 2022
Golden AI
Edits made to:
Infobox (+7 properties)
US Patent 10432168 Systems and methods for quartz wafer bonding
Infobox
Is a
Patent jurisdiction
Patent number
10432168
Date of patent
October 1, 2019
Patent application number
14841314
Date Filed
August 31, 2015
Patent primary examiner
Find more entities like US Patent 10432168 Systems and methods for quartz wafer bonding
Use the Golden Query Tool to find similar entities by any field in the Knowledge Graph, including industry, location, and more.
