Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
October 1, 2019
Patent Application Number
16051876
Date Filed
August 1, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A passive structure using conductive pillar technology instead of through via technology includes a substrate having a first redistribution layer (RDL) and a three-dimensional (3D) integrated passive device on the substrate. The passive structure includes multiple pillars on the substrate where each of the pillars is taller than the 3D integrated passive device. The passive structure further includes a molding compound on the substrate surrounding the 3D integrated passive device and the pillars. Furthermore, the passive structure includes multiple external interconnects coupled to the first RDL through the pillars.
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