Is a
Patent attributes
Patent Applicant
Current Assignee
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sen-Kuei Hsu0
Ming-Hsien Tsai0
Hsin-Yu Pan0
Date of Patent
April 5, 2022
0Patent Application Number
170220640
Date Filed
September 15, 2020
0Patent Citations
Patent Primary Examiner
A package structure includes an insulating encapsulation, a semiconductor die, and a filter structure. The semiconductor die is encapsulated in the insulating encapsulation. The filter structure is electrically coupled to the semiconductor die, wherein the filter structure includes a patterned metallization layer with a pattern having a double-spiral having aligned centroids thereof.
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