Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Anna Katharina Krefft0
Claus Reitlinger0
Date of Patent
October 8, 2019
0Patent Application Number
161061170
Date Filed
August 21, 2018
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Some features pertain to a package that includes an enhanced electromagnetic shield. The package includes a substrate, an electronic component coupled to the substrate, and a mold partially surrounding the electronic component. The package further includes a first shield over the mold, and a second shield over the first shield. One of the first shield or the second shield is a high permeability shield and the remaining first or second shield is a high conductivity shield relative to the high permeability shield.
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