US Patent 10470294 Reduction of passive components in system-in-package devices
Patent 10470294 was granted and assigned to Octavo Systems on November, 2019 by the United States Patent and Trademark Office.
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Patent abstract
Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.
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Patent Inventor Names
Erik James Welsh0
Peter Linder0
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US Patent 10470294 Reduction of passive components in system-in-package devices
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Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10470294
Date of patent
November 5, 2019
Patent application number
15968171
Date Filed
May 1, 2018
Patent primary examiner
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