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US Patent 11416050 Component communications in system-in-package systems

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Is a

Patent attributes

Patent Applicant

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

Date of Patent

August 16, 2022

Patent Application Number

15589823

Date Filed

May 8, 2017

Patent Citations

US Patent 10714430 EMI shield for molded packages

US Patent 10204890 Substrate for system in package (SIP) devices

US Patent 10470294 Reduction of passive components in system-in-package devices

US Patent 10922251 Electronic device and method for controlling same

Patent Primary Examiner

Manuel A Rivera Vargas

CPC Code

A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.

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