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US Patent 11416050 Component communications in system-in-package systems
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Patent
Date Filed
May 8, 2017
Date of Patent
August 16, 2022
Patent Applicant
Octavo Systems
Patent Application Number
15589823
Patent Citations
US Patent 10714430 EMI shield for molded packages
US Patent 10204890 Substrate for system in package (SIP) devices
US Patent 10470294 Reduction of passive components in system-in-package devices
US Patent 10922251 Electronic device and method for controlling same
Patent Jurisdiction
United States Patent and Trademark Office
Patent Number
11416050
Patent Primary Examiner
Manuel A Rivera Vargas
CPC Code
G01R 31/318508
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