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US Patent 10477725 Clustered heat dissipation device and chassis with same

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 12, 2018
Date of Patent
November 12, 2019
Patent Application Number
16217390
Patent Citations
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US Patent 10342159 Liquid heat-dissipating assembly
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US Patent 10111364 Coupling assemblies for connecting fluid-carrying components
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US Patent 10385996 Tapering couplers for connecting fluid flow components
0
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US Patent 10024606 Fabricating thermal transfer structure with in-plane tube lengths and out-of-plane tube bend(s)
0
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US Patent 10104810 Coupling assemblies for connecting fluid-carrying components
Patent Citations Received
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US Patent 11937399 Server, liquid cooling device and cold plate assembly
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US Patent 11540428 Network equipment power supply and heat dissipation system therefor
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US Patent 10925187 Remote heat exchanger arm for direct contact liquid cooling for rack mounted equipment
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US Patent 11700709 Redundant module and systems for high density servers
0
Patent Inventor Names
Mu-Shu Fan
0
Chien-An Chen
0
Chien-Yu Chen
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10477725
Patent Primary Examiner
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Robert J Hoffberg

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