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US Patent 10481351 Semicondcutor packages

OverviewStructured DataIssuesContributorsActivity
Is a
Patent
Patent
Date Filed
December 19, 2018
Date of Patent
November 19, 2019
Patent Application Number
16224801
Patent Citations
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US Patent 10162139 Semicondcutor package
0
Patent Citations Received
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US Patent 11892693 Photonic quantum computer assembly
0
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US Patent 11493713 Photonic quantum computer assembly having dies with specific contact configuration and matched CTE
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US Patent 11550108 Quantum computing die assembly with thru-silicon vias
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US Patent 10996410 Methods of forming semiconductor packages
0
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US Patent 11493714 Quantum computing die assembly with thru-silicon vias and connected logic circuit
Patent Inventor Names
Chuei-Tang Wang
0
Jeng-Shien Hsieh
0
Chen-Hua Yu
0
Hsing-Kuo Hsia
0
Patent Jurisdiction
United States Patent and Trademark Office
United States Patent and Trademark Office
Patent Number
10481351

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