Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Sung Won Kim0
Heedae Oh0
Date of Patent
November 26, 2019
0Patent Application Number
156103280
Date Filed
May 31, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
An integrated hot stamping structure formed by integrally coupling a plurality of blanks and hot stamping-molding the integrated blanks, may include a reinforcing member disposed in a hot stamping area of a predetermined strength reinforcing portion configured for absorbing a shock and reinforcing local rigidity of the strength reinforcing portion.
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