US Patent 10486749 Integrated hot stamping structure
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Patent abstract
An integrated hot stamping structure formed by integrally coupling a plurality of blanks and hot stamping-molding the integrated blanks, may include a reinforcing member disposed in a hot stamping area of a predetermined strength reinforcing portion configured for absorbing a shock and reinforcing local rigidity of the strength reinforcing portion.
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Patent Inventor Names
Heedae Oh0
Sung Won Kim0
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Patent Citations Received
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Patent Jurisdiction
Patent Number
104867490
Date of Patent
November 26, 2019
0Patent Application Number
156103280
Date Filed
May 31, 2017
0Patent Primary Examiner
Edits on 30 Jan, 2022
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US Patent 10486749 Integrated hot stamping structure
Infobox
Is a
Patent jurisdiction
Patent number
10486749
Date of patent
November 26, 2019
Patent application number
15610328
Date Filed
May 31, 2017
Patent primary examiner
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