Is a
Patent attributes
Patent Jurisdiction
Patent Number
Date of Patent
November 26, 2019
Patent Application Number
15938324
Date Filed
March 28, 2018
Patent Citations Received
Patent Primary Examiner
Patent abstract
A semiconductor device structure and method for forming the same are provided. The semiconductor device structure includes a substrate and a conductive pad formed over the substrate. The semiconductor device structure also includes a protection layer formed over the conductive pad, and the protection layer has a trench. The semiconductor device structure further includes a conductive structure accessibly arranged through the trench of the protection layer and electrically connected to the conductive pad. The conductive structure has a curved top surface that defines an apex, and an apex of the curved top surface is higher than a top surface of the protection layer.
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