US Patent 12062550 Molded direct contact interconnect substrate and methods of making same

The disclosure concerns method of making a molded substrate, comprising providing a carrier; forming a first conductive layer and first vertical conductive contacts over the carrier; disposing a first layer of encapsulant over the first conductive layer and first vertical conductive contacts; planarizing the first vertical conductive contacts and the first layer of encapsulant to form a first planar surface; forming a second conductive layer and second vertical conductive contacts over the first layer of encapsulant and configured to be electrically coupled with the first conductive layer and first vertical conductive contacts; disposing a second layer of encapsulant over the second conductive layer and second vertical conductive contacts; planarizing the second vertical conductive contacts and the second layer of encapsulant to form a second planar surface; and forming first conductive bumps over the second planar surface, opposite the carrier.