US Patent 10879224 Package structure, die and method of manufacturing the same

Patent 10879224 was granted and assigned to Taiwan Semiconductor Manufacturing Company on December, 2020 by the United States Patent and Trademark Office.

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Patent

Patent attributes

Current Assignee

Taiwan Semiconductor Manufacturing Company

Patent Jurisdiction

United States Patent and Trademark Office

Patent Number

10879224

Date of Patent

December 29, 2020

Patent Application Number

16260127

Date Filed

January 29, 2019

Patent Citations Received

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US Patent 12062550 Molded direct contact interconnect substrate and methods of making same

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US Patent 11749534 Quad flat no-lead (QFN) package without leadframe and direct contact interconnect build-up structure and method for making the same

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US Patent 11973051 Molded direct contact interconnect structure without capture pads and method for the same

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US Patent 11056411 Chip packaging structure

Patent Primary Examiner

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Tu-Tu V Ho

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