US Patent 10497650 Semiconductor device and manufacturing method thereof
Patent 10497650 was granted and assigned to Amkor Technology on December, 2019 by the United States Patent and Trademark Office.
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Patent abstract
A semiconductor device having an EMI shield layer and/or EMI shielding wires, and a manufacturing method thereof, are provided. In an example embodiment, the semiconductor device includes a semiconductor die, an EMI shield layer shielding the semiconductor die, and an encapsulating portion encapsulating the EMI shield layer. In another example embodiment, the semiconductor device further includes EMI shielding wires extending from the EMI shield layer and shielding the semiconductor die.
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Patent Inventor Names
Dae Gon Kim0
Jae Min Na0
Kwang Mo Chris Lim0
KyeRyung Kim0
Soo Hyun Kim0
SungSun Park0
Tae Kyung Hwang0
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Patent Number
104976500
Date of Patent
December 3, 2019
0Patent Application Number
154870240
Date Filed
April 13, 2017
0Patent Citations Received
Patent Primary Examiner
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US Patent 10497650 Semiconductor device and manufacturing method thereof
Infobox
Is a
Patent applicant
Current assignee
Patent jurisdiction
Patent number
10497650
Date of patent
December 3, 2019
Patent application number
15487024
Date Filed
April 13, 2017
Patent primary examiner
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