Is a
Patent attributes
Patent Jurisdiction
Patent Number
Patent Inventor Names
Yung-Ping Chiang0
Ming-Kai Liu0
Ting-Chu Ko0
Yu-Sheng Hsieh0
Chang-Wen Huang0
Han-Ping Pu0
Date of Patent
December 10, 2019
0Patent Application Number
157179740
Date Filed
September 28, 2017
0Patent Citations Received
Patent Primary Examiner
Patent abstract
Provided is a package structure includes a die having a first connector, a RDL structure disposed on the die, and a second connector. The RDL structure includes at least one elongated via located on and connected to the first connector. The second connector is disposed on and connected to the RDL structure.
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