US Patent 10504865 Package structure and method of manufacturing the same
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Patent abstract
Provided is a package structure includes a die having a first connector, a RDL structure disposed on the die, and a second connector. The RDL structure includes at least one elongated via located on and connected to the first connector. The second connector is disposed on and connected to the RDL structure.
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Patent Inventor Names
Chang-Wen Huang0
Han-Ping Pu0
Ming-Kai Liu0
Ting-Chu Ko0
Yu-Sheng Hsieh0
Yung-Ping Chiang0
Edits on 30 Apr, 2023
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Patent Citations Received
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Infobox
Is a
Patent Jurisdiction
Patent Number
105048650
Date of Patent
December 10, 2019
0Patent Application Number
157179740
Date Filed
September 28, 2017
0Patent Primary Examiner
Edits on 31 Jan, 2022
Golden AI
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Infobox (+7 properties)
US Patent 10504865 Package structure and method of manufacturing the same
Infobox
Is a
Patent jurisdiction
Patent number
10504865
Date of patent
December 10, 2019
Patent application number
15717974
Date Filed
September 28, 2017
Patent primary examiner
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